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Embedded PC 
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features
System Size : 178W x 125D x 52.7H (mm)
Intel® Core™ i3-1115G4E Processor
Dual Channel DDR4, 2 x SO-DIMMs
2 x HDMI for Dual display
2 x GbE LAN Ports
spec
Ordering Information
6BQP1115AMR-SI (Box Packing)
QBiX-Pro-TGLA1115G4EH-A2 is bundled with GIGAIPC 3.5" SBC QBiP-1115G4EB, powered by the onboard Intel® Core™ i3-1115G4E Processor. It provides high-performance, power-efficient but low power consumption features. This fanless embedded system can operate under wide temperatures ranging from -10°C to 50°C and pass industrial-grade standard of 50G shock and 5rms vibration. Moreover, it supports independent 4K Ultra HD displays via 2 x HDMI for multi-display applications. This product is suitable for space-limited applications with highly strict performance requirements for industrial computers, control system and more.
Specification
| Dimension | 178W x 125D x 52.7H(mm) |
| CPU | Intel® Core™ i3-1115G4E Processor 10nm SuperFin, 2 cores, 4 threads, up to 3.9 GHz |
| Chipset | SoC |
| Memory | 2 x DDR4 SO-DIMM sockets, Max. Capacity 64 GB Support Dual Channel DDR4 3200 MHz memory modules |
| Ethernet | 2 x GbE LAN Ports (Intel® I219V and Intel® I211AT) |
| Graphic Support | Integrated Graphics Processor - Intel® UHD Graphics for 11th Gen Intel® Processors : 2 x HDMI 2.0 ports, supporting a maximum resolution of 4096x2160 @60Hz (2 independent display outputs) |
| Audio | Realtek® Audio Codec |
| Storage | 1 x 2.5” HDD/SSD (SATA 6Gb/s) |
| Expansion Slots | 1 x 2280 M.2 M-Key (PCIe x2, SATA 6Gb/s) 1 x 2230 M.2 E-Key (WiFi/BT) 1 x Full-size Mini PCIe with SIM slot (PCIe x1 + USB2.0) -- support 3G/4G module |
| Front I/O | 2 x RJ45 LAN Ports 4 x USB 3.2 Gen 2x1 2 x HDMI 1 x Power button with LED 1 x HDD LED 1 x COM Port (RS-232/422/485 & RI/5V/12V) |
| Rear I/O | 2 x USB 2.0 2 x COM Ports (RS-232/422/485) 1 x GPIO (8 bits) 1 x Headphone Jack 1 x Screw Type DC Jack |
| Side I/O | 2 x External Antenna Holes (Optional) |
| Power | +9V~36VDC (Adapter 19.5V/135W) |
| Operation Temperature | Operating temperature: 0°C to 50°C Operating humidity: 0-90% (non-condensing) Non-operating temperature: -40°C to 85°C Non-operating humidity: 0%-95% (non-condensing) Use wide temperature range memory and storage |
| Vibration During Operation | Operation: IEC 60068-2-64, 5 Grms, random, 5 ~ 500 Hz, 1 hr / Per Axis, With SSD/M.2 2280 Non-operation: IEC 60068-2-6, 2 G, Sine, 10 ~ 500 Hz, 1 Oct/min, 1 hr / Per Axis |
| Shock During Operation | Operation: IEC 60068-2-27, 50 G, half sine, 11 ms duration, With SSD |
| Packaging Content | Carton size: 505 x 333 x 231 (mm) Packing Capacity: 5pcs Single Box size: 313 x 191 x 95 (mm) Single Box weight: Approx. 1.9kg Including: Screw I Head for 2.5" HDD M3x8L x 4 (P/N: 25KSG-130081-K1R) Thermal Pad for Memory x 1 (P/N: 25ST3-200086-T5R) SATA Cable x 1 (P/N: 25CRI-070000-S9R) Power Cord : Optional (by region) PSU ADP 19.5V 135W 100-240VAC x 1 (P/N: 25EP4-201352-C1S) |
| Order Information | 6BQP1115AMR-SI (Box Packing) |
| Optional Kit | TPM 2.0 module P/N: 9CTM010NR-00 TPM Cable P/N: 25CRZ-100600-S9R |